Part Number Hot Search : 
MM3Z10VS RD82F FT1211DH 1004P LC3KP28A BT3904 TM5103 S2020
Product Description
Full Text Search
 

To Download MMBV3401LT1G Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 MMBV3401LT1G Silicon Pin Diode
This device is designed primarily for VHF band switching applications but is also suitable for use in general-purpose switching circuits. Supplied in a Surface Mount package.
Features
* Rugged PIN Structure Coupled with Wirebond Construction
for Optimum Reliability
http://onsemi.com
* Low Capacitance - 0.7 pF (Typ) at VR = 20 Vdc * Very Low Series Resistance at 100 MHz * These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
Compliant 0.34 W (Typ) @ IF = 10 mAdc
3 Cathode
1 Anode
3 1
MAXIMUM RATINGS
Rating Reverse Voltage Forward Power Dissipation @ TA = 25C Derate above 25C Junction Temperature Storage Temperature Range Symbol VR PD Value 35 200 2.0 +125 -55 to +150 Unit Vdc mW mW/C C C
2
SOT-23 (TO-236AB) CASE 318-08 STYLE 8
MARKING DIAGRAM
4D M G G 1 4D = Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location.
TJ Tstg
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
Device MMBV3401L T1G MMBV3401L T3G Package SOT-23 (Pb-Free) Shipping 3000 Tape & Reel
SOT-23 10,000 Tape & Reel (Pb-Free)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2009
August, 2009 - Rev. 6
1
Publication Order Number: MMBV3401LT1/D
MMBV3401LT1G
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Reverse Breakdown Voltage (IR = 10 mAdc) Diode Capacitance (VR = 20 Vdc) Series Resistance (Figure 1) (IF = 10 mAdc, f = 100 MHz) Reverse Leakage Current (VR = 25 Vdc) Symbol V(BR)R CT RS IR Min 35 - - - Typ - - - - Max - 1.0 0.7 0.1 Unit Vdc pF W mAdc
TYPICAL CHARACTERISTICS
1.6 R S , SERIES RESISTANCE (OHMS) I F , FORWARD CURRENT (mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 2.0 4.0 6.0 8.0 10 12 14 16 IF, FORWARD CURRENT (mA) 0 0.5 0.6 0.7 0.8 0.9 1.0 TA = 25C 50
40
30 TA = 25C 20
10
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Series Resistance
Figure 2. Forward Voltage
20 C T , DIODE CAPACITANCE (pF) I R , REVERSE CURRENT ( A) 10 7.0 5.0 2.0 1.0 0.7 0.5
100 40 10 4.0 1.0 0.4 0.1 0.04 0.01 0.004 VR = 25 Vdc
TA = 25C
0.2 +3.0
0
-3.0 -6.0 -9.0
-12
-15
-18
-21
-24
-27
0.001 -60
-20
0
+20
+60
+100
+140
VR, REVERSE VOLTAGE (VOLTS)
TA, AMBIENT TEMPERATURE (C)
Figure 3. Diode Capacitance
Figure 4. Leakage Current
http://onsemi.com
2
MMBV3401LT1G
PACKAGE DIMENSIONS
SOT-23 (TO-236AB) CASE 318-08 ISSUE AN
D
SEE VIEW C 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318-01 THRU -07 AND -09 OBSOLETE, NEW STANDARD 318-08. MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A 0.89 1.00 1.11 0.035 0.040 0.044 A1 0.01 0.06 0.10 0.001 0.002 0.004 b 0.37 0.44 0.50 0.015 0.018 0.020 c 0.09 0.13 0.18 0.003 0.005 0.007 D 2.80 2.90 3.04 0.110 0.114 0.120 E 1.20 1.30 1.40 0.047 0.051 0.055 e 1.78 1.90 2.04 0.070 0.075 0.081 L 0.10 0.20 0.30 0.004 0.008 0.012 0.35 0.54 0.69 0.014 0.021 0.029 L1 HE 2.10 2.40 2.64 0.083 0.094 0.104 STYLE 8: PIN 1. ANODE 2. NO CONNECTION 3. CATHODE
E
1 2
HE c e b q 0.25
A A1 L L1 VIEW C
SOLDERING FOOTPRINT*
0.95 0.037 0.95 0.037
2.0 0.079 0.9 0.035
SCALE 10:1
0.8 0.031
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loca Sales Representative
http://onsemi.com
3
MMBV3401LT1/D


▲Up To Search▲   

 
Price & Availability of MMBV3401LT1G

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X